Device for processing substrate

专利名称：Device for processing substrate发明人：中田 勝喜,谷垣内 平道申请号：JP2017230252申请日：20171130公开号：JP2019098586A公开日：20190624

专利附图：

摘要：Problem to be solved: to improve the substrate separation ability in thesubstrate processing apparatus. In the substrate processing apparatus 1, the scribe lineforming apparatus 3 forms a plurality of first scribe lines S1 and a plurality of secondscribe lines S2 orthogonal to the substrate 100.The first fragmentation apparatus 7

divides the substrate 100 along a plurality of first scribe lines S1 to form a plurality ofstrip like substrates 111.The adsorption rotary apparatus rotates the plurality of striplike substrates 111 by 90 degrees in plan view.The second displacing device 9 is disposeddownstream of the first displacing device 7 in the conveying direction and divides theplurality of strip like substrates 111 along a plurality of second scribe lines S2 to form aplurality of unit substrates 113.The conveying device 29 conveys a plurality of strip likesubstrates 111 from the first displacing device 7 to the second displacing device9.Diagram

申请人：三星ダイヤモンド工業株式会社

地址：大阪府摂津市香露園３２番１２号

国籍：JP

代理人：新樹グローバル・アイピー特許業務法人

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